V 4.5V 4.0V 3.5V 3.0V 2.8V 2.5V 1000 www.DataSheet4U.com TOP VGS 10V 5.0V 4.5V 4.0V 3.5V 3.0V 2.8V 2.5V 100 BOTTOM ID, Drain-to-Source Current (A) ID, Drain-to-Sourc.

PCB assembly equipment and vapor phase, infra-red or convection soldering techniques, when application note AN-1035 is .

The IRF6619 combines the latest HEXFET® Power MOSFET Silicon technology with the advanced DirectFETTM packaging to achieve the lowest on-state resistance in a package that has the footprint of an SO-8 and only 0.7 mm profile. The DirectFET package is.

IRF6610

IRF6611

IRF6611PbF

IRF6611TRPbF

IRF6612

IRF6612PbF

IRF6612TR1

IRF6613

IRF6613PBF

IRF6613TRPBF

IRF6614

IRF6614PBF

IRF6614TRPBF